Samsung Electronics has announced that the company is now starting to mass production the embedded package on package (ePoP) memory to use on smartphone and tablet.
This all in one memory that including 3GB of LPDDR3 DRAM with 32GB embedded multi media card (eMMC) and controller. The benefits of this ePoP chip that very thin (1,4mm) and packed in one package with 15 x 15-mm in size, help to save up to 40% space on the devices.
This new ePoP memory support for 64-bit I/O bandwidth with data transfer rate up to 1,866 Mbps and high energy efficiency. Samsung also has planned to expand their ePoP lineup and keep develop to improve performance and increase the space of memory for these chip, in next few years.